Designed For X-ray Analysis Of Electronic
  • Inspect BGA, Flip Chip and other surface mounted components.
  • Analyze BGAs for voids, bridging, size, shape, and missing balls.
  • Check dies for defects, such as voids, cracks and faulty wire bonds.
      For a list of LKH-5000 features, see the Comparison Chart on the Products page.

Auto-BGA Feature: Click here to download a video demonstration.
One click to analyze a full-screen array. One click to zoom-in on a single solder ball.
One click to save your analysis data in an Excel spreadsheet.