LKH-5000
Designed For X-ray Analysis Of Electronic Assemblies
- Inspect BGA, Flip Chip and other surface mounted components.
- Analyze BGAs for voids, bridging, size, shape, and missing balls.
- Check dies for defects, such as voids, cracks and faulty wire bonds.
For a list of LKH-5000 features, see the Comparison Chart on the Products page.
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